Protective Coatings

DLC & PVD coatings for the semiconductor industry

Problem

In semiconductor production, wear and particle abrasion on precision components – such as wafer handling components, grippers and bearings – lead to significant problems in process reliability. Material abrasion and particle contamination can contaminate sensitive substrates and thus cause yield losses, rejects and system downtimes. Friction and adhesion on sensitive functional surfaces are particularly critical, affecting positioning accuracy, process stability and cleanroom suitability. In an industry where micro- and nanometers determine quality and yield, even the slightest particle abrasion can have a significant impact on the reliability and efficiency of production.

Solution

With its laser-based PVD coating technology, ANTACON offers an effective solution for the high demands of semiconductor production. The ultra-smooth, wear-resistant and low-particle DLC coating reduces friction and adhesion on wafer handling components such as wafer chucks – on which DLC coatings are already successfully used to minimize abrasion and particle formation. At the same time, the chemically inert surface protects sensitive functional surfaces from contamination and corrosion. This ensures that positioning accuracy, cleanroom suitability and process stability are maintained in the long term. The result: longer service life, lower contamination risks and higher yields in all process steps of semiconductor production.

Advantages of DLC and PVD coatings

  • Up to 5 times longer service life for highly stressed functional surfaces & components

  • Protection of high-precision functional surfaces such as microstructures when handling abrasive materials

  • Less friction

  • Extreme abrasion resistance & corrosion protection for special operating conditions

  • Ideal for series production
    (from batch size 1 to medium series)

HIGH-END
PROTECTION
without compromise

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Applications in the semiconductor industry

Wafer chucks, grinders, drive components, pick & place systems, gripper fingers, transport systems, valve seats e.g. sealing surfaces, wafer handling components, precision bearings, transport rollers and guide elements

Clean handling, reliable processes – DLC2.0 for maximum quality in semiconductor production

    these challenges

    Can we solve

    In semiconductor manufacturing, even minimal abrasion can disrupt entire process chains and cause high downtime costs. Surfaces such as handling systems must therefore remain absolutely clean, stable, and free of particles.

    • Friction

      Mixed friction, dry friction

    • Wear and tear

      abrasive wear, adhesive wear, wear-intensive

    • Corrosion

      susceptible to corrosion, rust-forming, unstable, not chemically inert

    • High operating costs

      Maintenance-intensive, cost-intensive, inefficient